IV-W2000
Automated Wafer Vision
Inspection Machine
System Housing Dimensions:
1400 x 1150 x 1540 mm (WxDxH)
A very competitively priced wafer inspection system for pre and post sawing in semiconductor backend operation.
System Capabilities:
- Handle 6-/18-/12-inch wafer, hoop ring or framed wafers
- English, Chinese and Japanese language UI options
- SECS/GEM to FTP communication ready for real-time data collection
- Automated wafer loader – unloader
- Offline assist and review software Inker reject module
- Inker reject module
Inspection Scope
Chipped / broken die
Micro crack lines
Scratches