Automated Die & Wire Bond
Inspection Machine

System Housing Dimensions:

1200 x 1200 x 1820 mm (WxDxH)

Automated 2D/3D vision inspection machine for wire bonding and other surface defects.

 System Capabilities

  • Flexibility to dock with different material handling system:
    • JEDEC Tray
    • Waffle Pack
    • Nikko Rack
    • Carrier Boat
    • Lead Frame
    • PCB Assembly
  • Available in single or dual track loading option
  • Quick tray change of 5 to 7 seconds
  • Large inspection area of 600 x 500 mm (WxD)

Inspection Scope

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