IV-T3300
Automated Die & Wire Bond
Inspection Machine

Automated 2D/3D vision inspection machine for wire bonding and other surface defects.

 System Capabilities

• Flexibility to dock with different material handling system:
  • JEDEC Tray
  • Waffle Pack
  • Nikko Rack
  • Carrier Boat
  • Lead Frame
  • PCB Assembly
• Available in single or dual track loading option
• Quick tray change of 5 to 7 seconds
• Large inspection area of 600 x 500 mm (WxD)