Automated Wafer Vision
Inspection Machine

System Housing Dimensions:

1400 x 1150 x 1540 mm (WxDxH)

A very competitively priced wafer inspection system for pre and post sawing in semiconductor backend operation.

System Capabilities:
  • Handle 6-/18-/12-inch wafer, hoop ring or framed wafers
  • English, Chinese and Japanese language UI options
  • SECS/GEM to FTP communication ready for real-time data collection
  • Automated wafer loader – unloader
  • Offline assist and review software Inker reject module
  • Inker reject module

Inspection Scope

Get Your Free Consultation Now.