IV-E1700
Automated Post Die & Wire Bond
Inspection Machine

System Housing Dimensions:

1600 x 1200 x 2000 mm (WxDxH)

A proven and effective 2D/3D FOL autovision inspection system for package and lead frame implemented in many IDM and OSAT factories.

 System Capabilities

  • Lead frame handling size from 110-300 (L) x 16-100 (W) x 0.1-1.5mm (thickness)
  • Reject module option of inker, lead punch or laser cut
  • Patented 3D Stereo Vision Triangulation, control software and lightning
  • Customisable optics to suit production requirements
  • Data traceability to improve FOL processes

Inspection Scope

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