IV-E1700
Automated Post Die & Wire Bond
Inspection Machine
System Housing Dimensions:
1600 x 1200 x 2000 mm (WxDxH)
A proven and effective 2D/3D FOL autovision inspection system for package and lead frame implemented in many IDM and OSAT factories.
System Capabilities
- Lead frame handling size from 110-300 (L) x 16-100 (W) x 0.1-1.5mm (thickness)
- Reject module option of inker, lead punch or laser cut
- Patented 3D Stereo Vision Triangulation, control software and lighting
- Customisable optics to suit production requirements
- Data traceability to improve FOL processes
Inspection Scope
Epoxy / solder coverage
Die placement / orientation / tilt
Missing die / wire
Scratches / chipping
Inked die
Contamination / foreign materials
Bond / stitch placement
Wrong bond / short / double bond
Smashed / deformed ball bond
Distorted / broken / wire sweep
Wire loop height
Lifted stitch
Extra mark on lead
Wire to wire short